Model：

SYJ-150 Low Speed Diamond Saw

Brief Introduction：

SYJ-150 Low Speed Diamond Saw is CE certified, used to precision cut the material samples for researching. Such as crystal, ceramic, glass, rock, mineral, refractory materials, PCB board, metal, building materials, plastic samples etc.

Main

Feature：

Used for precision cutting the material samples, high torque, running steady, can cut the thickness of various materials(0.1mm). Suitable for samples' follow-up thinning, polishing and various operation.

Technical

  Parameter：

1. Speed range：20-600RPM stepless speed adjust

2. Voltage：AC 110V/220V
3. Position accuracy：0.01mm(Mechanical and digital display, digital display should be purchased in selection)
4. Two dimension, angle adjustable：spinning 360°
5. Travel distance：50mm（Fine adjustment travel distance 25mm）
6. Max dia. wafer blade：100mm（4 inch）
7. Automatic shut off：allowed unattended
8. Digital display axis RPM

Specification：

Size：360×260×260mm  Weight：17.5kg

Standard Accessories：

Optional Accessories ：

1. Sintered diamond Blade:Φ100mm×12.7mm×0.33mm                    
2. Electroplating diamond blade:Φ100mm×12.7mm×0.4mm            
3. Sic blade:Φ100mm×12.7mm×0.4mm                                            
4. Al₂O₃ blade:Φ100mm×12.7mm×0.4mm