performance parameter:

1.    The station is small and light and easy to repair by the modual design, it is unneccessary to connect

external pressed air and working volatge is 220V.

2.    This station is with powerful fuction, which can dismantle, solder and align, mount automaticlly.

3.    It is intelligent and easy to operate, controlling by PLC.

4.    The optical alignment system apply special prism and high-accuracy CCD system, thus the user can

observe the two images(BGA(CSP) chip bottom tin soldering and BGA(CSP) soldering pad on the PCB)

overlapping. The chip can be accurately mounted by the fine adjustment along X and Y axis and the angel

adjustment.

5.    It has three heating areas, which is good for lead free reworking.

6.    Wth a large bottom heating area of 300X400mm and hot net.

7.    Six temperature segments, which can totally simulate the result of soldering oven.

8.    Seperated 5 points structure, which can prevent the bend of PCB board. It is suitable for laptop and

LCD TV repair.

9.    After heating, using high current constant fan to cool PCB in case of being out of shape and to keep

the good effect of soldering..

10.    It is with audio prompt when dismantling and soldering finishes, and the vacuum suction pen can

suck the BGA, which is convenient, reliable and durable.